Technical Skills

Technical Skills

  •    3000+ hours of cleanroom working experience
  •    Advanced level
  • Focused Electron beam induced deposition and etching (FEBID-FEBIE)
  • Scanning Electron Microscope (SEM)
  • Energy Dispersive Spectroscopy (EDX)
  • Focused Ion Beam (FIB)
  • Atomic Force Microscope (AFM)
  • Cryogenic transport measurements (Heliox VL)
  •    Basic level
  • Transmission electron microscope (TEM)
  • E-beam lithography (EBL)
  • Nanoimprint lithography (NIL)
  • Microcontact printing
  • Self assembled monolayer (SAM)
  • Fluorescence Microscope
  • Field programmable gate array (FPGA) based microprocessor and digital system design-implementation
  •    Standard level
  • Magnetic Force Microscope (MFM)
  • Photolithography & Sputtering
  • Reactive Ion & Plasma etching
  • Ultraviolet-visible spectroscopy (UV-Vis)